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PCB Layout

Advanced PCB Techniques and Substrates

Via-in-pad, blind and buried via, HDI micro-via, via modeling, and via-stub management
Rigid, flex, and rigid-flex substrates

High Power and High Voltage Design

High-power density DC-DC switcher expertise
High-voltage – up to 5,000 VDC creepage and clearance

Modeling and Analysis

Full 3D modeling – STEP file generation
CAM / DFM review
Mechanical design support
Thermal analysis
Signal integrity and EMC optimizations – pre and post route analysis with Mentor Hyperlynx GHZ tools
Crosstalk minimization driven through routing constraints and verified with post-route analysis with Hyperlynx Boardsim

Optimizations and Simulations

DFM / DFT / DFA optimizations
Low noise precision analog
10 to 20 GHZ+ FPGA SERDES channels
Low loss dielectrics, spread-glass options
S-Parameter extraction for insertion loss and return loss modeling
IBIS-AMI based channel analysis
DDR2/DDR3/DDR4 memory subsystems (including DDR4 @ 1.2 GHz)
Power Integrity – low-inductance PDN design
BGA via-field DC drop simulation
Spreadsheet-based AC analysis

Ready to Partner?

Let’s talk about your unique challenges and how Re:Build AppliedLogix can help you.