Signal and power integrity engineering increasingly becomes mandatory with faster data rates and chips that have lower voltage and higher current power. As design margins shrink, design methods such as relying on reference designs and vendor guidance become increasingly risky. Those methods typically don’t substantiate why a design works with rigorous or quantitative engineering basis. Rather, they rely on logic such as, ‘the reference design works’ or ‘the vendor says this is what to do, so it must be right.’ Numerical analysis conveying margin may be entirely absent. As margins shrink, designing without deeper understanding of the relevant engineering risks the following problems.
Troubleshooting signal and power integrity issues can consume countless hours, delaying product launches and straining valuable resources. When designers lack a strong SI/PI background, they often struggle to solve root-cause complex problems, feeling like they’re searching for a needle in a haystack.
As data rates increase, traditional rework options are increasingly precluded. This means that when design flaws are discovered late in the process, a costly and time-consuming board re-spin is often the only solution. This not only adds to development expenses but also throws off critical project schedules.
Without a deeper understanding of signal and power integrity principles or the right analytical tools, debugging can devolve into a trial-and-error approach. This iterative process often leads to multiple, costly board spins as designers fix symptoms rather than addressing the underlying root causes, leaving designs vulnerable to future problems.
Missed deadlines create a ripple effect throughout an organization. They directly impact product releases, erode market share, and ultimately, hurt the bottom line. The opportunity cost of not addressing SI/PI proactively can be far greater than the investment in proper design.
Re:Build AppliedLogix integrates signal and power integrity engineering throughout the entire design process. Neglecting it earlier in the design process often leads to worse outcomes. Our approach starts with a foundation in electromagnetic fundamentals and critical thinking. We build on that with simulation and measurement tools, experience, and active engagement in industry to stay modern.
We work closely with you and your team to understand your needs and inform on architecture tradeoffs. For instance, implementing 100 Gigabit Ethernet (GbE) over four channels of 25 GbE, two channels of 50 GbE, or one channel of 100 GbE and over a backplane versus cabling is an architectural decision we can inform on.
We assist with component selection and meticulous schematic review, catching potential issues early. This includes identifying margin risks in high-load DDR channels lacking 2T timing or suboptimal power/ground pinouts on critical chips like SerDes.
We apply pre-layout simulation for many purposes. Exploring margin, choosing materials, and designing interconnect geometry for GHz-range bandwidth are SerDes-related examples. Exploring routing topology, tuning component values, and determining driver/receiver configuration are examples common to single-ended signaling.
We collaborate with the PCB designer, HW engineer, FPGA engineer, SW engineer, and the PCB fabricator to balance and optimize design considerations across all disciplines. Systematic and thorough PCB review for adherence to pre-layout constraints and application of electromagnetic fundamentals is our norm.
Our standard practice includes post-layout simulation for power integrity, uncovering suboptimal sense line placement and plane shapes while meticulously accounting for PCB parasitics in AC analysis. For signal integrity, it’s crucial for applications like skew tuning DDRx SDRAM and analyzing areas requiring constraint compromises.
While simulation excels at exploring design spaces, we integrate measurement and validation when margins are thin or clients need extra confidence. This includes using ‘signal integrity coupons’ to verify fabrication matches simulation, and feeding measurements back to create highly accurate, measurement-based models for both SI and PI.
We engineer high-speed serial links from 1 to 100+ Gbps, utilizing advanced tools and techniques like 3D EM field solvers, IBIS AMI modeling, and ERL/COM analysis. Our expertise spans various protocols, including PCIe and Ethernet.
We have extensive experience in memory interface engineering, from older DDR generations to the latest DDR5. We handle chip-down and DIMM-based designs, including challenging multi-rank/multi-load scenarios. We also address the critical power integrity requirements of modern memory buses.
We expertly handle MHz-rate signals, including SPI buses, LVDS/PECL/CML signals, and parallel processor/FPGA buses. We optimize driver and receiver configurations, control impedance, and manage crosstalk to ensure signal quality.
We engineer low-noise power delivery networks for high-current, low-voltage rails (sub-1mΩ impedance), sensitive PLL and SerDes rails, and auxiliary power rails with limited copper space. We’re adept at optimizing power for low-margin DDRx memory and very fine-pitch BGAs, with low inductance and low-Q power distribution being our standard.
We routinely work with large, complex BGAs, including 1000+ ball SoCs, FPGAs, processors, and ASICs, as they typically encompass many signal and power integrity challenges. We adeptly manage the balance between layout, DFM, and the intricate SI/PI considerations these multi-interface components present.
Our expertise extends beyond individual boards to encompass system-level, multi-board, and die-to-die engineering. We can simulate and measure entire systems, including cables and interconnects.
In today’s complex digital landscape, signal and power integrity issues can derail projects and inflate budgets. Re:Build AppliedLogix offers a distinct advantage: we minimize these risks and maximize the performance of your designs. Our value proposition goes beyond simply “fixing” problems. We proactively address potential challenges before they impact your project timeline or bottom line.
We combine deep theoretical understanding with a proven track record of delivering robust designs for diverse applications. We leverage electromagnetic principles to anticipate and mitigate potential issues early, saving you time and money.
It’s important to us to prevent problems, not just react to them. Our approach, from requirements definition to hardware verification, ensures signal and power integrity are considered at every stage.
Our goal is that you see our engineers as an extension of your team. We foster open communication and collaboration throughout the design process, keeping you informed and involved. Your success is our success.
Don’t let signal and power integrity issues become a roadblock to your product’s success. Partner with AppliedLogix and gain the confidence that comes from working with a team of experienced engineers dedicated to delivering exceptional results. Contact us to discuss your project needs and discover how we can help you achieve your goals.
